Molex 53748 Leiterplattenleiste Vertikal, 20-polig / 2-reihig, Raster 500 μm Raster Oberfläche, Platine-Platine,

RS Best.-Nr.:: 179-6631
Herst. Teile-Nr.:: 53748-0208-TR750
Marke:: Molex

Molex 53748 Leiterplattenleiste Vertikal, 20-polig / 2-reihig, Raster 500 μm Raster Oberfläche, Platine-Platine,

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RS Best.-Nr.:: 179-6631
Herst. Teile-Nr.:: 53748-0208-TR750
Marke:: Molex

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Alle auswählen	Eigenschaft	Wert
	Marke	Molex
	Serie	53748
	Produkt Typ	Leiterplattenleiste
	Montageausrichtung	Vertikal
	Anzahl der Kontakte	20
	Anzahl der Reihen	2
	Rastermaß	500 μm
	Montageart	Oberfläche
	Steckverbindersystem	Platine-Platine, Platine-Platine
	Ummantelt/Nicht ummantelt	Ummantelt
	Kontakt Gender	Stecker
	Kontaktmaterial	Messing, Messing
	Kontaktbeschichtung	Gold, Gold
	Stromstärke	500 mA
	Maximale Betriebstemperatur	105 °C
	Betriebstemperatur min.	-40 °C
	Reihenabstand	500 μm
	Normen/Zulassungen	No
	Anschlusstyp	Lot
	Spannung	50 V

	Alle auswählen
	Marke Molex
	Serie 53748
	Produkt Typ Leiterplattenleiste
	Montageausrichtung Vertikal
	Anzahl der Kontakte 20
	Anzahl der Reihen 2
	Rastermaß 500 μm
	Montageart Oberfläche
	Steckverbindersystem Platine-Platine, Platine-Platine
	Ummantelt/Nicht ummantelt Ummantelt
	Kontakt Gender Stecker
	Kontaktmaterial Messing, Messing
	Kontaktbeschichtung Gold, Gold
	Stromstärke 500 mA
	Maximale Betriebstemperatur 105 °C
	Betriebstemperatur min. -40 °C
	Reihenabstand 500 μm
	Normen/Zulassungen No
	Anschlusstyp Lot
	Spannung 50 V

Ursprungsland:: JP

Molex 53748 Series PCB Header, 20 Contacts, 0.5mm Pitch - 53748-0208-TR750

This PCB header is a part of the SlimStack™ series, specifically designed for board-to-board applications. Featuring a compact 0.5mm pitch, this surface mount connector is configured in a dual-row format with 20 circuits. With a vertical body orientation and a stack height of 3.00mm, it is engineered for integration in various electronic devices.

Features & Benefits

• Suitable for surface mounting, simplifying assembly processes

• Shrouded design prevents misalignment during connection

• Dual-row layout optimises space utilisation on PCB

• Solder termination method ensures robust and reliable connections

• Gold plating enhances electrical conductivity and corrosion resistance

• Operating temperature range of -40°C to +105°C accommodates various environments

Applications

• Utilised for communication devices to create secure connections

• Implemented in consumer electronics for efficient signal transfer

• Employed in automation systems to ensure reliable board-to-board connectivity

• Integrated into medical equipment for dependable performance

• Commonly used in automotive for robust circuitry

How do the gold plating and brass materials enhance performance?

The gold plating delivers superior conductivity, whilst the brass offers excellent mechanical strength, reducing the risk of connection failure during operation.

What are the considerations for using this connector in high-temperature environments?

The connector is designed to operate within a broad temperature range, ensuring reliable performance even in challenging conditions, thereby maintaining signal integrity.

How does the shrouded design contribute to the ease of use?

The shrouded design helps prevent misalignment during mating, making connections straightforward and facilitating quicker assembly processes, especially in high-volume manufacturing.