Molex DIMM Sockel 850 μm 288-polig Gerade Oberfläche DDR4 78730
- RS Best.-Nr.:
- 179-1982
- Herst. Teile-Nr.:
- 78730-1002
- Marke:
- Molex
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- RS Best.-Nr.:
- 179-1982
- Herst. Teile-Nr.:
- 78730-1002
- Marke:
- Molex
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Alle auswählen | Eigenschaft | Wert |
|---|---|---|
| Marke | Molex | |
| Produkt Typ | DIMM Sockel | |
| Rastermaß | 850 μm | |
| Anzahl der Kontakte | 288 | |
| Montageausrichtung | Gerade | |
| Montageart | Oberfläche | |
| SDRAM Typ | DDR4 | |
| Serie | 78730 | |
| Kontaktmaterial | Kupferlegierung | |
| Gehäusematerial | Nylon | |
| Rastend | Ja | |
| Kontaktwiderstand max. | 10.0 mΩ | |
| Maximale Betriebstemperatur | 85 °C | |
| Typ des Speichersteckplatzes | DIMM | |
| Betriebstemperatur min. | -55 °C | |
| Reihenabstand | 850 μm | |
| Alle auswählen | ||
|---|---|---|
Marke Molex | ||
Produkt Typ DIMM Sockel | ||
Rastermaß 850 μm | ||
Anzahl der Kontakte 288 | ||
Montageausrichtung Gerade | ||
Montageart Oberfläche | ||
SDRAM Typ DDR4 | ||
Serie 78730 | ||
Kontaktmaterial Kupferlegierung | ||
Gehäusematerial Nylon | ||
Rastend Ja | ||
Kontaktwiderstand max. 10.0 mΩ | ||
Maximale Betriebstemperatur 85 °C | ||
Typ des Speichersteckplatzes DIMM | ||
Betriebstemperatur min. -55 °C | ||
Reihenabstand 850 μm | ||
- Ursprungsland:
- CN
Molex 78730 Series DIMM Socket, 288 Contacts, 0.85mm Pitch - 78730-1002
This DDR4 DIMM socket is a high-speed memory socket designed for vertical surface mount applications. It features a robust housing MADE from nylon and accommodates 288 circuits with a pitch of 0.85mm. The socket is constructed for performance and reliability, supporting a range of operating temperatures from -55°C to +85°C. It employs copper alloy contacts with gold over nickel plating, ensuring durability and optimal electrical conductivity.
Features & Benefits
• Supports 288 contacts for extensive memory interfacing
• Vertical surface mount design for efficient PCB usage
• Features high-speed copper alloy contacts for enhanced performance
• Gold over nickel plating provides superior corrosion resistance
• Solder termination method ensures secure and reliable connections
• Compatible with PCB thicknesses of 1.57mm and 3.18mm for design flexibility
Applications
• Utilised in automation systems requiring high-performance memory
• Essential for electronics manufacturing in computer systems
• Used for surface mount designs in Compact electronic devices
• Ideal for where space-saving is critical
• Commonly employed in high-speed data transfer environments
What is the recommended current rating for each contact in this socket?
The maximum current rating per contact is 750mA, ensuring sufficient power handling for effective operation in various applications.
How does the design contribute to the durability of the socket?
The structure supports a maximum of 25 mating cycles, ensuring reliability in frequent assembly and disassembly while maintaining performance.
What is the typical voltage rating for operational use?
The maximum voltage rating for this socket is 29Vrms, making it suitable for a range of electrical tasks.
Can this socket withstand extreme temperatures during operation?
Yes, it can operate within a temperature range of -55°C to +85°C, accommodating diverse environmental conditions encountered in different applications.
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- Molex DIMM Sockel 0.85 mm 288-polig gewinkelt Leiterplattenmontage DDR4 29V eff. 151080 750mA
- Molex Buchse 0.85 mm 288-polig Vertikal Presssitz DDR4 29V 78731 750mA
- Molex Buchse 0.85 mm 288-polig Vertikal Durchsteckmontage DDR4 29V 78726 750mA
- Molex DIMM Sockel 0.5 mm 288-polig Vertikal Oberfläche DDR4 29 V ac, 29V dc 151105 750mA
- TE Connectivity Stecksockel Bauform 0.85 mm 288-polig Vertikal Platine DDR4 25V 750mA
